In this survey we explore the hardware aspects of reconfigurable computing machines , from single chip architecture to multichip systems , including internal structure and external coupling 在某一时刻一条指令执行过程中整个处理器的部件都服务于尽快完成这条指令,至少在概念上如此。
Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology 覆盖范围从热性能和半导体材料的mosfet ,数字逻辑家庭,记忆体装置,微处理器,数位类比和模拟到数字转换器,数字滤波器,以及多芯片组件技术。
Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density 多芯片组件( mcm )是微电子封装的高级形式,它是把裸芯片与微型元件组装在同一个高密度布线基板上,组成能够完成一定的功能的模块甚至子系统。