In this paper , the author discussed the design of comprehensive system , instrument and measurement in order to meet the need of the straightness measurement of super - length guideway testing and alignment system , development of super - length orbit straightness measurement system in detail 基于超长导轨测试及调整系统的直线度检测的需要,本文详细论述了超长导轨直线性检测系统的综合系统设计方案、仪器研制方案及其测试方案。
In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations 本文针对倒装贴片机的自动对准系统开展了以下几方面的工作:首先在讨论了现有的对准方法和自动贴片机的对准光路系统基础上,针对贴片机实际应用环境,提出基于多点自动对焦的芯片调平方法。
In the function decision and structure design , the function and the flow of the wafer pre - alignment system are analyzed , the system architecture is selected and the precision of this system is analyzed , the driving mode and the system structure are fixed , and then the motor and raster are selected . at the same time , the structure of parts is designed on consideration of the request and the function of the vacuum grasping of wafer 在总体方案和机构设计方面,分析了晶圆预对准系统的功能与流程,选定了系统的整体方案,确定了系统各单元的驱动方式和机构形式,完成了驱动和检测部分的选型,同时充分考虑机构中气动吸附部分的功能与要求,设计了预对准单元的机构。
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry . it develops for the mass production of ic , mems and moems with small feature sizes and high precise bonding demands . an alignment system is one of the key components in flip chip bonders 全自动倒装贴片机( flipchipbonder )是半导体生产工艺中完成芯片和基底对准、键合的高精度自动化设备,适合于特征尺寸小,键合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大规模生产。
In the wafer - cycle fitting algorithm , comparing with circumgyration radius approach , track fitting approach , and least square circle fitting approach . in the wafer pre - alignment system , the wafer square fitting algorithm - least square circle fitting approach , based on optical linear ccd sensor , as well as the theoretical error analyze of this algorithm 在晶圆检测算法方面,比较回转半径法、轨迹拟合法以及最小二乘圆法,选择光学线阵ccd的晶圆圆心最小二乘圆法作为系统晶圆圆心的检测方法。
The water ' s absorption in tissues is particularly great , so the erbium laser is suitable . simultaneously we design the laser alignment system , the laser shaping system and the focal setting system . doing the theoretical analysis and experiments , we research and develop a medical blood - sampling instalment of laser , with the good application prospect 因为掺铒yag固体激光器输出的中心波长为2 . 94 m ,与水的吸收峰相吻合,而且皮肤组织中水的吸收非常显著,所以铒激光是合适的,同时设计了激光对准系统、激光整形系统和聚焦系统,通过理论和实验研究,研制出一台激光采血仪样机,具有良好的应用前景。