Detail specification of ceramic pga for semiconductor integrated circuits 半导体集成电路陶瓷针栅阵列外壳.详细规范
At present , bga / csp is becoming the mainstream of the advanced ic package technology 目前微电子球栅阵列尺寸封装( bga csp )正成为高端ic封装的主流技术。
Adaptor - carrier quad flat pack to pin grid array sockets for use in electronic equipment , detail specification for 电子设备用插针格栅阵列插座的载体方形扁平组件的适配器用详细规范
Adapter - carrier quad flat pack to pin grid array sockets for use in electronic equipment , blank detail specification for 电子设备用插针格栅阵列插座的载体方形扁平组件的适配器用空白详细规范
Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array 半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南
Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely now . but the package has a new structrue , and the old routing algorithms are not used 鉴于球栅阵列封装( bga )的优点,这种技术成为目前最广泛的封装形式。然而由于球栅阵列封装( bga )结构的特殊性,对于这种封装上的布线算法不同于普通的布线算法。